63-4140-06 Heatsink, BGA, 23.4K/W, 23 x 23 x 18mm, Adhesive Foil 306216
Features
- BGA Heatsink, Tape mounting. A range of BGA heatsinks with thermally conductive adhesive tape mounting. Tape mounting saves board space by eliminating mounting holes Convenient peel and stick assembly is quick and clean Pin Fin array allows omni-directional airflow to maximize heat dissipation
Spec
- Quantity：1piece
- For Use With : BGA
- Length : 23mm
- Width : 23mm
- Height : 18mm
- Dimensions : 23 x 23 x 18mm
- Thermal Resistance : 23.4K/W
- Mounting : Adhesive Foil
- Colour : Black
- CODE No.:104-036
Package size：75×70×30 mm 10 g [About Package size]
| Order No. | 63-4140-06 | |
|---|---|---|
| Model No. | 306216 | |
| Standard price |
JPY: 470
USD: 2.92
Excange rate 1USD= 160.72JPY
Valid price in Japan |
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| Quantity | 1piece | |
| Stock in Japan |
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| Supplier Stock |
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