61-0411-46 Solder Removing Machine SD-20
Features
- Since the pump and suction nozzle are directly connected, a quick vacuum arrival time and instant strong suction (vacuum arrival 650mmHg) are realized.
- High-power (100 V/100 W) high-capacity ceramic heaters are used, making them ideal for solder removal work on multilayer substrates (4 to 8 layers).
- The floating structure of the mechanical part further reduces vibration and noise.
- You can also remove SMD parts by operating the hot air switch lever and using the dedicated hot air nozzle.
- There is no clogging of the nozzle even if the original discharge function removes lead-free solder.
Spec
- Case size (width): 248mm
- Case size (depth): 253mm
- Case size (height): 77mm
- Body weight: 1.1kg (set weight)
- Accessories: Carrying case, Standard Tip (Φ1.0), Preliminary Tip (hole diameter Φ1.5), Preliminary filter cartridge x 2 pieces, Cleaning Pin, 2P - 3P Conversion plug
Package size：262×262×80 mm 1.28 kg [About Package size]
| Order No. | 61-0411-46 | |
|---|---|---|
| Model No. | SD-20 | |
| JAN Code | 4989833057206 | |
| Standard price |
JPY: 61,100
USD: 380.16
Excange rate 1USD= 160.72JPY
Valid price in Japan |
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| Quantity | 1piece | |
| Stock in Japan |
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| Supplier Stock |
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